The whiskering phenomenon has cause the reliability issues which induce short circuit in the electronic manufacturing industries. The research is conducted to study on the formation of pure tin whiskers under the control of stress and temperature with the application of mechanical indentation and the formation of whiskers can be classified into distinct shape accordingly. The specified ranges of stress and surrounding temperature are set up accordingly to promote the whiskering mechanism of pure tin whiskers. The pure tin (Sn) whiskers formed is examined in term of the properties of morphology characterization via OM and SEM to analysis on the effect of stress and temperature on the growth morphology of pure tin whiskers.
This report outlines the research in progress on the development of the pure tin whisker formation.
